Chiplet SI/PI Engineer: Packaging & Interconnects
Eliyan Corporation
Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies. The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits. #J-18808-Ljbffr Eliyan Corporation
Vacancy posted 3 days ago
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