Principal Physical Design Architect, HBM
Micron Technology, Inc.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Design Architect, you will support the development of advanced analog, mixed‑signal, and digital circuits as well as full‑chip integration for next‑generation High Bandwidth Memory (HBM) products. This role focuses on physical design and layout, including creating optimized floorplans, driving circuit placement and routing strategies, and delivering high‑quality block‑level layouts using advanced process nodes. You will collaborate closely with architecture, circuit build, and layout teams to enable groundbreaking DRAM solutions that push performance, power efficiency, and density for developing HBM technologies. Responsibilities Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks. Deliver block‑level analog or mixed‑signal layouts using advanced foundry process technologies. Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies. Evaluate timing, area, power, and complexity trade‑offs for high‑speed DRAM and mixed‑signal circuits. Support integration of Memory, Logic, and Analog circuits for new HBM product architectures. Ensure alignment with developed rules, manufacturability requirements, and physical verification constraints. Provide design‑focused insights to improve circuit robustness, performance, and reliability. Participate in reviews and fixing issues across physical build, parasitic extraction, and full‑chip integration. Qualifications MS degree with 5+ years of memory‑related layout or physical design experience, or BS degree with 7+ years of relevant experience. Expertise with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS. Strong understanding of analog layout fundamentals including matching, EM, latch‑up, coupling, IR‑drop, crosstalk, and parasitic impacts. Hands‑on experience developing analog and mixed‑signal layouts (e.g., sense amplifiers, LDOs, PLLs). Strong analytical, problem‑solving, and collaboration skills. Preferred Qualifications Experience working on DRAM, SRAM, or memory‑centric physical design. Ability to clearly communicate technical concepts to design, architecture, and verification teams. Motivated contributor who excels in team‑based, fast‑paced engineering environments. Benefits As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc.
- Micron Technology, Inc. is seeking an HBM Design Architect to support the development of next-generation High Bandwidth Memory products. This role involves physical design, layout creation, and collaboration with architecture and circuit teams. Ideal candidates should...Suggested
- ...Micron Technology – HBM Design Architect Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member...PrincipalLocal area
$177k - $334k
Micron Technology, Inc. is seeking a SoC Physical Design Engineer to implement advanced HBM SoC designs in Richardson, Texas. This hands-on role involves collaboration across teams for top-level integration and achieving performance targets. Candidates should have strong...Suggested$146k - $297k
Job Summary Micron Technology is seeking an HBM Design Architect to contribute to advanced HBM solutions that drive performance for AI, ML, and... ...knowledge of CMOS circuit design and semiconductor device physics. Experience with schematic entry and circuit simulation using...SuggestedLocal area$146k - $297k
...the world to learn, communicate and advance faster than ever. HBM Design Architect We are the HBM Architecture team at Micron, focused on... ...Strong knowledge of CMOS circuit design and semiconductor device physics Experience with schematic entry and circuit simulation...SuggestedFull timeLocal area- ...Act as the tapeout execution and release coordination lead for HBM designs targeting internal Micron manufacturing. Own and manage... ...and track closure of signoff readiness items (timing, power, physical verification, integration constraints), ensuring clear ownership...PrincipalLocal area
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...communicate and advance faster than ever. We are part of Micron’s HBM Design Architecture organization, where we push the limits of memory... ...or equivalent industry experience Strong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devices Hands‑on...PrincipalLocal area- ...advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design,... ...signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing... ...operation, or build Understanding of Physical Layout & Circuit Floor Planning...PrincipalLocal area
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Micron Technology, Inc in Richardson, Texas is seeking an HBM Design Architect to contribute to cutting-edge memory solutions. You will analyze and design digital and analog circuits for advanced HBM products in collaboration with a skilled team, focusing on functionality...- Micron Technology, Inc is seeking a Lead Low Power Architect to define SoC-level power architecture for next‑gen HBM logic dies and memory‑centric SoCs. You will... ...and collaborate across RTL, verification, and physical design to implement power intent. The role requires deep...
$146k - $297k
Micron Technology is looking for an HBM Design Architect in Richardson, Texas, to contribute to advanced memory solutions for AI and high-performance computing. The role involves designing and analyzing digital and analog circuits for DRAM products. Qualifications include...$146k - $297k
Micron Technology is seeking an HBM Design Architect based in Richardson, Texas. This full-time role involves defining and implementing testing architectures for next-generation memory products. The ideal candidate should have a Bachelor's or Master’s degree in Electrical...Full time- Micron Technology, Inc. is seeking an HBM Design Architect in Richardson, Texas. In this role, you will design a high-speed interface between DRAM and Base die within the HBM cube. You will work with an innovative team on advanced memory technologies and contribute to...
- Req ID: JR101356 | SoC Architect - Low Power Design (HBM) Micron Technology is a world leader in innovating memory and storage solutions that accelerate... .... You will work across architecture, RTL, verification, physical design, firmware, and product teams to deliver industry‑...Local areaRelocation
- 1000 Micron Technology, Inc. is hiring an HBM Design Architect in Richardson, Texas. You will contribute to innovative HBM solutions for AI and high-performance computing by designing and analyzing digital and analog circuits. The role requires a Bachelor's degree in Electrical...
- Micron Technology, Inc. seeks an HBM Design Architect in Richardson, Texas, to push the limits of memory performance for AI and computing. The role involves designing and analyzing digital and analog circuits for advanced HBM products, optimizing performance, and ensuring...
$148.1k - $192.5k
Qorvo, Inc. is seeking a Research Principal RF MMIC Designer in Richardson, TX, to drive innovative MMIC designs within its advanced research team. The role requires extensive experience with III-V semiconductor technologies, leading technical research, and mentoring junior...Principal$146k - $297k
...communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the... ...and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested...Full timeLocal area- ...Texas to take responsibility for high-speed DRAM and Base die interface in HBM cubes. The ideal candidate will have extensive experience in DRAM operations, analog and mixed-signal circuit design, and a strong ability to collaborate across teams. Candidates with a MS or...
- Micron Technology, Inc. is looking for a Staff Verification Architect to develop high bandwidth memory (HBM) solutions for AI and ML applications in Richardson, Texas. You will collaborate with a multi-functional team to create scalable verification solutions for next-generation...
$152k - $199k
...Enterprise Workload Automation Architect, you will be instrumental in... ...the opportunity to present designs and ideas to an Architecture... ...with RDBMS, NoSQL is a must for Principal and up. ~ Experience... ...ancestry, color, citizenship, physical or mental disability, perceived...PrincipalWork at officeLocal areaRelocationMonday to FridayFlexible hours$175k - $309k
...learning platforms. This role sits at the center of next‑generation HBM development and will serve as a senior signal‑integrity / power‑... ...extraction and modeling across PCB, package, and interposer designs. Establish SI/PI standards, methodologies, and sign‑off criteria...PrincipalLocal area- Responsibilities Define and own HBM IO and data path architecture... ...through tape‑out Architect and analyze TSV‑based HBM link... ...signaling strategy, and parasitic co‑design Define and drive HBM PHY IO... ...‑generation programs As a Principal Engineer in HBM IO Design Architecture...PrincipalLocal area
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