Electroplating Process Engineer - Advanced Packaging (2.5D/3D)
SkyWater Technology
A leading semiconductor manufacturer in Florida is seeking an Electroplating Process Development Engineer. The ideal candidate will develop electroplating processes for Advanced Packaging technologies like Hybrid Bonding. A BS in Engineering is required, with 7-10 years of experience desirable. This role involves leading improvements in manufacturing processes and utilizes metrology tools. A comprehensive benefits package is offered. #J-18808-Ljbffr SkyWater Technology
Vacancy posted 20 hours ago
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