Data Center Packaging Engineering Leader

AMD

AMD is seeking a visionary leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will guide cross-functional teams across design, SI/PI, OSAT partners, and management to deliver high-performance, high-complexity packages on aggressive timelines. The role emphasizes AI-enabled methodologies, process innovation, and collaboration with global teams to scale execution and ensure manufacturability and yield optimization.

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Vacancy posted 5 days ago

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