Director, Hardware Engineering

Director, Hardware Engineering About Us At InspireSemi, we’re not just building chips; we’re revolutionizing high-performance computing. Our groundbreaking architecture packs thousands of 64-bit CPU cores onto a single chip, all seamlessly connected. We’re driven by a mission to make high-performance computing more accessible, energy‑efficient, and easier for developers to harness. Ready to make a real impact? Join our passionate team! Why Join InspireSemi? Be a Pioneer: Get in on the ground floor of a hypergrowth startup! You’ll be part of the leadership team shaping the future of computing. Scale the Vision: You will have the opportunity to build, scale, and mentor a team. Rewarding Compensation: We offer a competitive salary, performance‑based bonuses, and significant equity. Flexibility: Benefit from a hybrid work model and flexible time off. The Opportunity We are seeking a Director of Hardware Engineering to lead our silicon development organization. You will oversee the entire hardware lifecycle, from initial architecture and RTL design to physical implementation, DFT, and post‑silicon bring‑up. What You’ll Do Strategic Silicon Roadmap: Own the hardware execution strategy. Make critical decisions on process node selection, third‑party IP integration, and package design. Team Scaling & Mentorship: Recruit and lead a world‑class team. Hardware‑Software Relationship: Partner with the Director of Software to ensure the hardware architecture is optimized for modern HPC workloads and compiler efficiency. Execution Excellence: Drive the methodology for multi‑site design synchronization, ensuring top‑tier verification coverage and first‑pass silicon success. Vendor & Foundry Management: Manage high‑level relationships with foundries, EDA vendors, and IP providers to ensure favorable terms and support. Post‑Silicon Leadership: Oversee the transition from GDSII to silicon bring‑up, working with yield and test engineering to drive high‑volume manufacturing readiness. What You Bring Experience: 15+ years in semiconductor engineering, with 8+ years in leadership roles managing complex SoC or CPU projects. Advanced Node Expertise: Proven track record leading development cycles for bleeding‑edge silicon, specifically at 5nm or below technology nodes. Education: A Bachelor’s or Master’s in Electrical Engineering or Computer Engineering. A PhD is a plus. Technical Mastery: Deep expertise in the full Netlist‑to‑GDSII flow, including high‑speed interconnects, memory hierarchies, and power delivery. Tape‑out Track Record: Proven history of leading multiple successful tape‑outs on advanced FinFET nodes. Business Acumen: Ability to balance technical perfection with time‑to‑market pressures and budgetary constraints. Influence: A strong reputation in the silicon industry with the ability to attract top‑tier talent and negotiate with global partners. Bonus Points Experience with large‑scale mesh interconnects or many‑core architectures. Background in advanced packaging (2.5D/3D IC, Chiplets). Direct experience with RISC‑V ISA implementation at scale. If you are a seasoned hardware leader ready to steer the development of the next generation of supercomputing silicon, we’d love to hear from you. #J-18808-Ljbffr