Media & Collateral Development Engineer - Semiconductor Packaging
Intel Corporation
Intel Corporation in Phoenix, AZ seeks an experienced materials and packaging technologist to develop media and collateral for assembly processes. You will optimize media quality, investigate DOE/ SPC driven improvements, and contribute to design of experiments to meet reliability and manufacturability goals. Role requires onsite presence, with a focus on advancing packaging technology, prototyping, and collaboration with cross-functional teams to meet milestones and reduce risk in manufacturing #J-18808-Ljbffr Intel Corporation
Vacancy posted 1 day ago
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