ASIC Package Eng Intern/Co-op: Design, Yield & Innovation
Advanced Micro Devices, Inc.
Advanced Micro Devices, Inc. (AMD) is offering an ASIC Package Engineering intern/co-op position in the US. You will work with a team of engineers to advance packaging technology, participate in substrate, interposer and bump design, and help optimize design verification and yield. The role requires full-time commitment (40 hours/week) in hybrid or onsite settings, with multiple location options across the US. #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 2 days ago
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