Masters ASIC Package Engineer Co-op/Intern
AMD
AMD is seeking a highly motivated ASIC Package Engineering intern/co-op in the US. You will work with a team of engineers to advance packaging technology for AMD products, from substrate to probe cards, and contribute to design verification and yield improvements. You must be enrolled in a US university with a Master’s in Electrical/Computer/Mechanical/Material science engineering or related field. This role is 40 hours a week, hybrid or onsite. #J-18808-Ljbffr AMD
Vacancy posted 2 days ago
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