Senior Thermal & Mechanical Packaging Architect
Annapurna Labs (U.S.) Inc.
Annapurna Labs (U.S.) Inc. in Austin seeks a Thermal & Mechanical Packaging Engineer to design and optimize hardware for AWS data centers. You will develop from circuit level to system level, including thermal solutions, and push designs toward high volume manufacturing. You’ll lead DOE studies, perform CFD/FEA with tools like ANSYS/ABAQUS/COMSOL, and collaborate across vendors, ODMs, and internal teams to meet performance, cost, and reliability targets. #J-18808-Ljbffr Annapurna Labs (U.S.) Inc.
Vacancy posted 13 hours ago
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