Senior Thermal & Packaging Research Engineer
Jobleads-US
Intel Corporation in Phoenix, AZ is seeking a Thermal Analysis Engineer to drive research on advanced semiconductor devices, packages, and interconnects. You will design, fabricate, and test prototypes, applying device physics and thermomechanical analysis to optimize performance and cost.
The role requires hands-on experimentation, collaboration across device, reliability, and fabrication teams, and expertise in DOE, simulations (Ansys/Abaqus), and programming (Python/MATLAB).
#J-18808-Ljbffr Jobleads-USVacancy posted 23 hours ago
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