Senior 3D/2.5D Package Layout Engineer for AI Accelerator
DensityAI
DensityAI is seeking an experienced package design lead in Mountain View to own the substrate and interposer layout end to end. You will coordinate with architecture, physical design, and OSAT partners to ensure seamless sign-off for high-performance multi-die packages. Responsibilities include defining stackups, bump mapping, RDL routing, and ensuring DRC/LVS compliance while driving design rule negotiations. AI-assisted tool workflows will accelerate layouts and signoff timelines. #J-18808-Ljbffr
Vacancy posted 4 days ago
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DensityAI
Mountain View, CA4 days ago
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