Senior Process Engineer

Senior Process Engineer

The Senior Process Engineer will lead the development, optimization, and scale-up of our micro-LED display manufacturing technology. Responsibility includes extensive hands-on experience in die-level bonding techniques, with a deep understanding of the full semiconductor process flow, including lithography and metal deposition. This position plays the lead role in both prototype fabrication and transferring technology from R&D to high-volume manufacturing.

Job duties and responsibilities:

• Develop, characterize, and optimize indium bump formation processes:
• Vacuum deposition (sputtering/evaporation) of under bump metal (UBM) and Indium
• Photolithography and lift-off patterning
• Bump geometry, pitch scaling, and bump surface quality
• Lead the process development of thermo-compression bonding for Chip-to-chip/die-to-die application:
• Design, execute, and analyze Design of Experiments (DOE) to characterize process windows, identify key control parameters, and improve bond yield, uniformity, and reliability.
• Perform root cause analysis for bonding-related failures (e.g., misalignment, non-contact, cracked die, high resistance) using SEM, FIB, X-ray and electrical testing
• Collaborate closely with equipment suppliers to perform both Indium bumping process and bonding trials at equipment vendor sites (travel required).
• Responsible for new tool qualifications, oversee preventative maintenances.
• Interface with chip and wafer supplier to ensure incoming material quality and compatibility with the bonding process.
• Develop and document robust process specifications, work instructions, and training materials for technicians.
• Implement Statistical Process Control (SPC) methodologies to monitor process stability and drive continuous improvement initiatives.
• Remains current with the latest advancements in advanced packaging, bonding techniques, and mass transfer technologies.

Minimum job requirements:

• Kopin is a defense contractor and is subject to International Traffic in Arms Regulations (ITAR). You must be a US Citizen or Permanent Resident (green card holder) to be considered for this position.
• A Bachelor of Science with exceptional demonstrated experience will be considered. M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field, preferred.
• 8+ years of hands-on experience in semiconductor process engineering, with a specific focus on die-level bonding, advanced packaging, or assembly.
• Proven, in-depth experience with one or more of the following is strongly preferred:
• Indium bumping process
• Thermo-Compression Bonding (TCB)
• Flip-Chip Attach process and materials
• Strong experience with bonding metrology and failure analysis techniques (C-SAM, X-ray, SEM/EDX, bond pull/shear testing).
• Strong foundational experience in other key semiconductor unit processes:
• Lithography: Hands-on experience with photoresist processing (coat, expose, develop), overlay registration, and critical dimension control. Knowledge of steppers/scanners is essential.
• Metal Deposition: Practical knowledge of Physical Vapor Deposition (PVD) techniques such as sputtering and evaporation for depositing adhesion layers, diffusion barriers, and seed layers (e.g., Ti, Cu, Al).
• Working Knowledge of silicon wafer dicing and coring processes, experience in wafer-to-chip singulation, yield improving, and minimizing die damages through data-driven process engineering.
• Proficiency in data analysis tools such as JMP, Minitab and experience with SPC and DOE.
• Deep understanding of interface science, solder metallurgy, and intermetallic compound (IMC) formation.
• Exceptional problem-solving skills and a data-driven, analytical approach to root cause investigation.
• Meticulous attention to detail and a relentless focus on yield and quality.
• Strong ability to work collaboratively in a cross-functional team environment.
• Excellent communication skills for effectively reporting findings and recommendations to both technical and management/leadership audiences.
• Self-motivated and capable of managing multiple projects in a fast-paced, startup-like environment.

Preferred job requirements:

• M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field preferred. A Bachelor of Science with exceptional demonstrated experience will be considered.
• Direct experience in Micro-LED, LED, or photonics fabrication and integration.
• Experience with thin-film transistor (TFT) backplane integration.
• Knowledge of wafer-level packaging processes.
• Experience in a high-volume manufacturing (HVM) environment and bringing processes from NPI to production.
• Familiarity with equipment from key vendors in the bonding and packaging space.

Physical requirements:

• Work is performed in an office environment and requires the ability to operate standard office equipment. Prolonged periods sitting at a desk and working on a computer. Must have the ability to lift 15 pounds and carry small parcels, packages, and other items, walk short distances, and gown according to clean room protocols as required.

The salary range for this position is $130,000 to $150,000 annually, plus bonus

Kopin Corporation is an Equal Employment Opportunity and Affirmative Action employer and as such all qualified applicants will be considered for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class. If an applicant needs a reasonable accommodation due to a disability with the application process, there is additional information on our website at