Advanced Packaging Technologist

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE In this role, you will lead the development of next-generation thermal technologies through rigorous model-based decision making. You will create and apply thermal and multi-physics models to guide architecture definition, design trade-offs, and technology direction across thermal, electro-thermal, and electro-optical domains, with a strong emphasis on package- and PCB-level integration. THE PERSON The ideal candidate is self-motivated, works independently, is highly organized and articulate, and collaborates effectively across cross-functional teams. You are comfortable using models to frame decisions, resolve ambiguity, and drive alignment across diverse engineering disciplines. KEY RESPONSIBILITIES Lead model-based thermal architecture development to support technology pathfinding and product roadmapping. Partner with package and system architects to deliver thermally optimized end-to-end solutions as part of System-Technology Co-Optimization (STCO). Collaborate with silicon design teams to enable thermally optimized power and performance while maintaining thermal margins, reliability, and long-term robustness. Define and execute characterization and validation strategies, partnering with internal and external thermal laboratories to calibrate and correlate models. Manage consortium and academic research engagements focused on advanced thermal technologies and modeling methodologies. Participate in technology reviews and evaluations with vendors and external partners. Define targets and strategic direction for thermal technology development, assess technology readiness, and influence AMD product roadmaps. Serve as thermal subject-matter expert within advanced packaging and technology integration, ensuring cohesive, end-to-end thermal solutions with a primary focus on data center applications. PREFERRED EXPERIENCE Direct experience in package- and system-level thermal modeling, coupled with experimental validation and characterization. Solid foundation in heat transfer, fluid dynamics, and materials science, with the ability to apply first-principles understanding to multi-physics package-and-system-level design trade-offs. Strong working knowledge of cooling and packaging technologies, including cold plates, vapor chambers, air-cooled heat sinks, thermal interface materials (TIMs), immersion cooling, microfluidics, and electronic packaging architectures. Experience developing cooling solutions across a range of platforms, including data centers (server- and rack-level cooling), servers (air- and liquid-cooled), mobile systems (laptops and notebooks), and workstations. Proven relevant industry or research experience in thermal engineering, electronics packaging, or related fields. ACADEMIC CREDENTIALS MS or PhD in relevant Engineering disciplines or physics. LOCATION Austin, Texas This role is not eligible for Visa sponsorship.

#LI-AJ1

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. #J-18808-Ljbffr Advanced Micro Devices