IC Packaging Design Engineer

Job Title : IC Packaging Design EngineerJob Location : Chandler, AZ/ Hillsboro, OR (Onsite)Duration : 12+ MonthsIf your skills, experience, and qualifications match those in this job overview, do not delay your application.Job Description: As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.What You'll DoPerform physical design and layout of IC packagesExecute substrate design and layoutImplement SI/PI-aware design practicesDesign for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)Ensure design rule compliance across all deliverablesUse Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design executionWhat You BringBachelor's or Master's degree in Electrical/Electronics xhyhwjd EngineeringSenior-level: ~10+ years in IC packaging / package design, ORMid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package designStrong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance