Remote Lead, High-Speed R&D & Signal Integrity Engineering

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TE Connectivity is seeking an experienced engineering leader to manage the integrated Hardware and Signal Integrity organization for high-speed external cable assemblies. You will own the lifecycle from architecture through production release, driving DAC/ACC/AEC architectures for OSFP, QSFP-DD, and related form factors in Ethernet, AI infrastructure, and PCIe.

Based in Troy, MI, this role leads global teams across hardware, PCB design, SI/PI analysis, and validation, delivering robust, scalable

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Vacancy posted 2 days ago

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