SiC Wafer and Package Technology Development Engineer
Onsemi
Job Description Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi. Responsibilities
About the Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact View email address on click.appcast.io for assistance.
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
- Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
- Document findings and process flows to create baseline for new technology platforms
- Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
- Strong communication skills
- Ability to lead development projects and implement strategies on a global basis
- Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding
- Knowledge of materials and material interactions
About the Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact View email address on click.appcast.io for assistance.
Vacancy posted 4 days ago
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