Senior ASIC Package Design Manager (SerDes & Power)
Broadcom Inc.
Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing flip‑chip‑BGA packages for ASICs with high‑speed SerDes and high‑power needs. The role sits in a worldwide R&D group developing high‑performance package designs for AI, networking, HPC, and 5G base stations, including 448G SerDes and related technologies. The manager will guide the engineering team, develop methodologies, and contribute to project management, with on‑site work five days a week and #J-18808-Ljbffr Broadcom Inc.
Vacancy posted 4 days ago
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