ASIC Package Design Manager

ASIC Package Design Manager Lead ASIC flip‑chip‑BGA package design programs across global engineering teams to meet schedule goals consistently. Location: San Jose, California, United States Compensation: $143,800 - 230,000 USD / year Job Tags: Product About The Role Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and very high‑performance power delivery needs. Job Description You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and project management. Responsibilities Understand the skill sets and traits of each team member, in order to maximize productivity and retention. Project Management: Create and track project plans for 20+ concurrent designs (scope, schedules, resources). Organize team and customer activities to keep projects on track. Communicate plans, status, next steps and risks. Create technical methodologies for package design. Steer package technology and design rules, with input from team members. Customer, vendor, and cross‑functional collaboration. Education, Experience & Requirements Preferred candidates have previous experience managing people and projects. BSEE/MSEE or similar field and 12+ years of experience in flip‑chip‑BGA package design, including high‑speed SerDes, with a minimum of 3 years in management. Knowledge of package‑level signal integrity and power integrity, to apply to package designs. Cooperate with our world‑wide team (multiple time zones), including co‑design with internal team members and external vendors. Self‑management and organization skills. Technical understanding related to package design, including life‑cycle, substrate and package integration in ASIC design and manufacturing flows. Design data creation and usage (.mcm, package spreadsheet, POD, lid, substrate drawings). DFx trade‑offs (manufacturability, reliability, supply assurance, SI/PI, etc). Layout, SI/PI extractions and simulations. Automation code development. Mechanical & thermal modeling. Project Management. New Business Quotes. Other Requirements This job requires working on‑site at the Broadcom office, five days a week. This is not a remote‑work position. Occasional travel may be required. Compensation and Benefits The annual base salary range for this position is USD 143,800.00 to USD 230,000.00. As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company’s growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: medical, dental and vision plans, 401(K) participation with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. #J-18808-Ljbffr Front Door Defense