Mechanical Engineering Intern: Thermal & IC Packaging
Qualcomm
Qualcomm Technologies, Inc. is seeking a Mechanical Engineering Intern in Austin for a 11–14 week summer program. You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor tech, collaborating with a team of engineers on IC packaging and cooling solutions. Alignment to Mechanical Engineering track based on resume. Qualified students gain hands-on experience, mentorship, relocation assistance, and housing during the internship, with opportunities to #J-18808-Ljbffr Qualcomm
Vacancy posted 1 day ago
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