Senior IC Packaging Engineer: NPI & Failure Analysis
NVIDIA
NVIDIA in Santa Clara, CA is seeking an experienced engineer to lead rapid IC packaging development for FA and NPI, coordinating with internal teams and external foundries to meet tight turnaround, reliability, and chip–package interaction goals. This role requires 12+ years in IC packaging, deep flip-chip and 2.5D/3D packaging knowledge, and hands-on use of Cadence Allegro Package Designer; strong FA tooling skills (SEM, EDX, CSAM, X-ray) and cross‑functional collaboration. #J-18808-Ljbffr NVIDIA
Vacancy posted 2 days ago
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