Director High Speed IO Architecture & Design

Job Description ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: Lead a Hardware/Digital IP Design Engineering team, collaborating across AMD and partner to develop next-generation high-speed I/O technologies. THE PERSON: An experienced semiconductor IP leader with strong technical and managerial expertise, exceptional communication skills, and a proven ability to lead high-performing engineering teams. KEY RESPONSIBILITIES:

• Provide technical leadership and direction for the hardware/digital semiconductor design engineering organization.
• Lead and manage a team of System, Digital hardware, front-end/RTL/logic designers.
• Manage and scale the design team to develop reusable IP supporting a multi products roadmap
• Collaborate with IP. Sub-System, and SoC architects to translate high-level requirements into microarchitecture and design implementation plans.
• Contribute to the definition of IP architecture & microarchitecture, circuit architecture, and digital subsystem blocks.
• Drive architectural decisions for next-generation products within committed system-architecture and power, performance, and area budgets.
• Represent the digital design organization in cross-functional architecture reviews, customer technical engagements, and foundry and EDA partner discussions.
• Mentor front-end digital designers and micro architects through design reviews, technical coaching, and silicon debug.
• Own high-level design planning, work breakdown, task assignment, progress tracking, schedule and priority management, performance reviews, talent development, and hiring.
• Partners with the peer engineering directors, program managers, architects, circuit and AMS teams, and physical-design leads to deliver high-quality results on schedule and against technical requirements.
• Proactively manages critical paths, dependencies, priorities, and overall program risk.
• Collaborate across analog design, custom digital design, AMS circuit architecture, AMS design verification, functional verification, physical design, and DFX teams across multiple geographies.
• Ensure strong cross-team alignment, engagement, and execution from architecture through production.
• Co-lead the silicon-success methodology, establishing first-silicon-success expectations, disciplined debug practices, and a clear path from characterization to production.
• Define and improve front-end development flows to increase execution efficiency, effectiveness, and quality.
• Establish and enforce design-flow best practices and quality standards to meet committed performance, power, reliability, area, and timing requirements.
• Work closely with physical-design and DFX teams to deliver complete RTL-to-GDSII designs.
• Co-own post-silicon planning and execution, including initial bring-up, platform validation, characterization, parameter optimization, and final productization.
• Contribute to IP production and bench-level test, characterization, and validation plans in partnership with post-silicon characterization and validation teams.
• Enable and support post-silicon workstreams through new product introduction.

PREFERRED EXPERIENCE:

• High-Speed IO subsystems (SerDes/Chip-To-Chip), high-speed interconnects, and IO sub-system/platform firmware
• Progressive experience in digital IO Sub-System IP hardware design and technical leadership.
• Strong engineering and people-management experience, including building, developing, mentoring, and leading distributed engineering/technical teams.
• Demonstrated success delivering complex digital-on-top IO Sub-System IPs (including mixed signal IPs) through high-volume production, including production tape-outs in advanced FinFET CMOS nodes.
• Expertise in developing low power, low latency, high-performance microarchitecture of IO Datapath between host and peripherals
• Demonstrated ability to concurrently manage complex IPs across multiple SOC programs.
• Deep knowledge and technical experience from architecture to implementation of High Speed IO (HSIO) & PHYs digital sub-systems.
• Strong knowledge of digital design methodologies, including clock-domain-crossing checks, reset checks, low-power design, synthesis, static timing analysis, and timing closure.
• Experience collaborating with physical-design and functional-verification teams to deliver complete RTL-to-GDSII designs.
• Embedded firmware development experience is an advantage.
• Strong analytical, problem-solving, decision-making, and organizational skills, with the ability to independently resolve complex technical and organizational challenges.
• Excellent written and verbal communication skills, including the ability to summarize complex issues for executives and engage deeply with architects and engineers.
• Demonstrated ability to manage, build and develop high-performing, diverse technical teams through strong mentoring, coaching, and performance management.
• Ability to establish durable working relationships and networks across functions and geographies.
• Highly self-motivated, detail-oriented, results-driven, and committed to disciplined engineering practices.
• Collaborative team player who actively develops personal leadership capability and supports the growth of others.

ACADEMIC CREDENTIALS:

• Master’s degree or Ph.D. in Electrical Engineering, Computer Engineering. Emphasis on IO sub-systems digital/hardware architecture and design including detailed knowledge of High-Speed IO subsystems (SerDes/Chip-To-Chip), high-speed interconnects, and IO sub-system/platform firmware

LOCATION: Santa Clara, CA This role is not eligible for visa sponsorship. #LI-TB2 *Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. *AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. *This posting is for an existing vacancy.