Intern: Next-Gen DRAM Process Integration Engineer
Micron USA Inc
Micron Technology in Boise invites a PhD candidate in Materials Science and Electrical Engineering to join the 3D DRAM organization. You will work on integration and device-level challenges, focusing on performance and manufacturability in a cutting‑edge 300mm R&D facility.
The role emphasizes cross‑functional collaboration and hands‑on experimentation. Ideal candidates will have strong data analysis skills, a passion for semiconductor innovation, and a drive to advance memory technology while
#J-18808-LjbffrVacancy posted 3 days ago
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