Failure Analysis Engineer — Advanced Packaging Test Interfaces

$134.8k - $202.2k

Qualcomm

Qualcomm is seeking a highly skilled Failure Analysis Engineer in San Diego to lead the development of FA test interfaces and thermal management solutions. The role supports critical design debug and yield improvement for various product lines. Candidates should have a strong foundation in electrical engineering, with experience in hardware design and a Bachelor’s degree in a related field. The position offers a competitive salary range of $134,800 to $202,200, plus bonuses and RSUs. #J-18808-Ljbffr Qualcomm

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Vacancy posted 5 days ago

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