Senior Packaging Engineer

Overview Qualcomm Technologies, Inc. is seeking an IC Package Engineering (PKGE) professional responsible for Package Mechanical Characterization, reliability evaluation of advanced IC packages, and system‑level interactions. The candidate should be a motivated self‑starter with strong technical depth, hands‑on execution capability, and the ability to translate experimental data into actionable insights to drive product reliability and development decisions. Responsibilities Define and execute Design of Experiments (DOE) for package, board‑level, and system‑level reliability evaluation. Perform PCB assembly, rework, and troubleshooting for test vehicles and products. Analyze experimental results using statistical methods and reliability modeling (e.g., Weibull analysis). Develop and implement new test methodologies to evaluate emerging packaging technologies. Collaborate with Design, NPI, FA, Thermal, and other teams. Provide guidance to technicians and support lab operations. Generate technical reports, documentation, and presentations for internal and customer‑facing use. Provide data‑driven recommendations to support design and product decisions. Interface with vendors and suppliers for new materials, equipment, and process improvements. Location and Employment Details This is an office based position located in San Diego, CA and is expected to comply with the company's onsite work policy. This is a U.S. based position and is not eligible for visa sponsorship. Minimum Qualifications Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field with 2+ years of System/Package Design/Technology Engineering or related work experience, or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field with 1+ year of System/Package Design/Technology Engineering or related work experience, or PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Preferred Qualifications Experience with semiconductor packaging, SMT/BLR processes, or mechanical characterization. Experience with mechanical stress/strain characterization. Hands‑on experience with reliability and mechanical test equipment, such as: Thermal Cycling Chambers (TC) Drop shock test system Instron or Universal Testing Machines (UTM) High‑speed Data Acquisition (DAQ) Systems Experience with metrology tools, such as: Shadow Moiré, DIC, TMA, DMA, C‑SAM, X‑ray Knowledge of industry standards (JEDEC, IPC, ASTM, AEC). Other Information Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm provides reasonable accommodations. For accommodations, contact disability‑View email address on click.appcast.io. EEO and Policies EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Compensation and Benefits Pay range: $127,200.00 – $190,800.00. Qualcomm offers a competitive benefits package and potential annual discretionary bonus program and RSU grants. Details discussed with the recruiter. #J-18808-Ljbffr Qualcomm