Remote RF Package Design Engineer - EM & SoC Packaging
Otava Rf
Otava Inc., based in Moorestown, New Jersey, develops RF and millimeter-wave chips and SoCs. We seek an EM/Package Design Engineer with strong RF/MW analysis background and some package design experience to join our collaborative team. The ideal candidate will perform electromagnetic analysis of 2.5D/3D packages, design multi-chip packages in Allegro, and present results in design reviews while contributing to development opportunities and career growth. #J-18808-Ljbffr
Vacancy posted 3 days ago
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