Head of Technical Programme Management

Job Role: Technical Program Manager III
The team is driving innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors. The need arises from increased project volume and the complexity of integrating new electrical components into wearable products.

Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components.
Experience in wearables, especially AR wearables and small electrical components.
Key Projects/Day-to-Day Responsibilities:
Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
Gather feedback, track schedules, and highlight risks throughout the development process.
Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.
Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.
Familiarity with small electrical component integration in compact form factors.
Knowledge of advanced PCB fabrication techniques and materials.
Minimum 5 years in electrical design, PCB development, or related hardware engineering roles.
Degree in Electrical Engineering or related field preferred, but not required.
working with Layout and Electrical engineers but LESS with vendor side