Packaging Module Equipment Development Engineer
$99.03k - $188.89kIntel
Job Details:Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.The Role and ImpactJoin Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions and enhance US based manufacturing. Your contributions will directly impact manufacturing efficiency, product reliability, and technological innovation, ensuring Intel remains at the forefront of the global semiconductor industry.Business groupIntel's Packaging Module Development team focuses on advancing assembly and packaging solutions that enable cutting-edge technologies across Intel's diverse product portfolio. The group collaborates with cross-functional teams to optimize manufacturing processes, enhance product reliability, and support Intel's mission to deliver world-class innovations that transform the way we compute.Key Responsibilities:Develop and optimize assembly processes and equipment to meet stringent quality, reliability, cost, yield, productivity, and manufacturability goals.Apply Design of Experiments (DOE) principles and statistical methods to refine processes and specifications, equipment capabilities and gaps, and documenting findings through technical reports.Ensure manufacturability of physical layouts in package designs, overseeing the lifecycle of manufacturing equipment health and long-term reliability from development through high volume manufacturingSupport integration of new materials and architectures into equipment for manufacturing success for advanced foundry customer product manufacturabilityInnovate new techniques, tools, and quality screens to proactively identify and address equipment health and reliability issues.Lead problem-solving initiatives and continuous improvement efforts for processes and equipment.Standardize equipment qualification practices and manufacturing quality systems while addressing technical risks aligned with product milestones.#cjQualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.Minimum Qualifications:US CitizenshipBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.Preferred Qualifications:Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.Experience with high-volume manufacturing including equipment troubleshooting and change qualificationUnderstanding of semiconductor fabrication processes and packaging technologies.Familiarity with equipment install and qualificationExperience with optimization of procedures or design for safety, quality and/or cost-effective manufacturabilityCollaborate with world-class teams, tackle meaningful challenges, and redefine industry standards while advancing your career. Apply today and become a key contributor to Intel's mission to shape the future of technology.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Arizona, PhoenixType: Full time
$115.11k - $219.55k
...essential job responsibilities.As an RF Module Development Engineer, you will be at the forefront of... ...software programs to drive advanced test equipment such as BERTS, scopes, and automatic... ...cutting-edge silicon process and packaging technology leadership for the AI era,...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $188.89k
...Description: The Role and ImpactJoin Intel's Packaging Module Development team and play a critical role in shaping... .... As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
...Description: The Advanced Packaging Technology Manufacturing (... ...Intel is responsible for the development and commercialization of... ....As a Packaging Module Development Engineer, you will:• Contribute to... ...innovation in next generation equipment, materials, and fabrication...SuggestedFull timeWork experience placementInternshipLocal areaImmediate startShift work$128.88k - $245.16k
...highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop,... ...including DRC, and density/fill modules. Industry experience with... ...semiconductor foundries, advanced packaging organizations (OSATs),...SuggestedFull timeLocal areaImmediate startShift work$115.11k - $219.55k
Intel is seeking an RF Module Development Engineer based in Phoenix, Arizona. In this role, you will drive innovation in analog... ...design, ATE testing, and the use of advanced lab equipment. A competitive compensation package includes an annual salary range of $115,110 - $21...Suggested$248.4k - $350.69k
...worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at... ...: Leads a team of module development engineers to... ...and oversees process and equipment performance in manufacturing... ...technology development, packaging, silicon process technologies...Full timeInternshipLocal areaImmediate startWorldwideShift work$211.4k - $298.44k
...worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at... ...etch processes across modules that may include plasma... ...plasma processing, etch equipment, process integration, metrology... ...edge silicon process and packaging technology leadership for...Full timeWork experience placementLocal areaImmediate startWorldwideShift work$133.8k - $188.89k
...Details:Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing... ...collaborates with equipment suppliers, internal development teams, quality, process, and...Full timeLocal areaImmediate startShift work$130k - $155k
...semiconductor company is seeking a Senior Equipment Engineer - Thin Films/Magnetics in the Phoenix,... ...offers a competitive compensation package including base salary, profit sharing and... ...Specific responsibilities will include:* Module process ownership: ownership of day-to-...Work experience placement$122.44k - $232.19k
...Organization and is focused on pathfinding and development of advanced memory technology. These... ...:Master degree in Electrical Engineering, Computer Engineering, Electrical and Computer... ...cutting-edge silicon process and packaging technology leadership for the AI era, enabling...Full timeInternshipLocal areaImmediate startShift work$116k - $159.5k
...leader in materials science and engineering solutions that are at the... ...display in the world. The equipment that we create and service is... ...site evaluations and Joint Development ProgramsResolves complex tool... ...to a comprehensive benefits package, candidates may be eligible...Full time- Talanto in the United States (Arizona, Phoenix) is seeking a Packaging Module Development Engineer in Laser Assembly to advance semiconductor packaging... .... You will help develop laser packaging processes and equipment, impacting performance and reliability of assembly...
$133.8k - $188.89k
...Details:Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically... ...floor and/or interacting with equipment/material suppliers. The candidate will...Full timeInternshipLocal areaImmediate startShift work$85.2k - $139.81k
...cause determination of assembled package yield loss and in-line... ...of week compressed shift. The engineer on shift will be responsible... ...well as shift 1 engineers and module partners, yield support, integration... ...lab environment or with lab equipment in academic setting....Full timeLocal areaImmediate startShift workAfternoon shift- NVIDIA is seeking a Senior CPU Design Methodology Engineer in the United States. The role focuses on building scalable SOC methodologies... ...processes, interfacing with ASIC, Physical Design, CAD, and packaging teams. You will drive RTL quality and automation across SOC...
- Join to apply for the Process Engineer role at M & M Industries,... ...producing high-quality plastic packaging solutions that make a... ...Creates and drives training and development opportunities for Process Technicians... ...requirements, workflow, and equipment layout for maximum...Full timeWork at office
- A leading packaging company based in Phoenix is seeking a Process Engineer to ensure quality output and optimize manufacturing processes. The role requires strong analytical skills, a degree in Mechanical Engineering or related fields, and 5+ years in injection molding...Full time
$122.44k - $232.19k
...below. Life at IntelPosition Summary: The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous... ...through reports, design guidance, IP, publications, and development-transfer inputs. Collaborate across research, design,...Full timeInternshipLocal areaImmediate startShift work$85.2k - $162.5k
...Details:Job Description: The Role and ImpactJoin Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping... ...to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation...Full timeInternshipLocal areaImmediate startShift work$160k - $220k
...), Wide Bandgap Power Devices, Product Engineering, NPI, Foundry Management, Reliability,... ...ResponsibilitiesLead SiC power products NPI: discrete, module, die salesEnsure all NPI schedules and... ...in new product platform roadmap development and designOversee external foundry SPC...Relocation package$172k - $236.5k
...leader in materials science and engineering solutions that are at the... ...display in the world. The equipment that we create and service is... ...influence next-generation product development. In this highly visible... ..., DRAM, NAND, or Advanced Packaging Technical Skills Design of...Full timeWorldwideRelocation$103.73k - $198.82k
...as we create exceptionally engineered technology and bring AI everywhere... ...and disciplined Strategic/Development Industrial Engineer to... ...architectures, processes, technologies, equipment, and other areasMaintaining... ...Wafer Fabrication, Advanced Packaging, Testing, and othersProven...Full timeInternshipLocal areaImmediate startShift work$52k - $200k
.... As a key member of the Project Execution Team, the Tool Equipment Install Engineer is an individual contributor reporting to the Tool Install... ...Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeContract workFor contractorsInternshipWork at officeLocal areaImmediate startShift work$145.6k - $276.8k
...investments in research and development, we offer capabilities and opportunity... ...of experience and renowned engineering expertise to meet the needs... ..., validation, fabrication, packaging, debugging, test development... ...simulation and define module interfaces for simulation....Contract workTemporary workWork experience placementWork at officeRemote workRelocationFlexible hours- Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging. The role emphasizes...
$120.86k - $170.63k
...innovative solutions. As a Strategic/Development Industrial Engineer within the Foundry Capacity... ...strategies. FCO ensures factories are equipped with the right tools, in the right place... ...ABenefitsWe offer a total compensation package that ranks among the best in the...Full timeLocal areaImmediate startShift work- ...Are IPL is a global leading sustainable packaging solutions provider that manufactures... ...quality standards are met. Collaborate with engineering and production teams to optimize... ...injection molding machines, auxiliary equipment, and related processes. Perform mold changes...Local areaNight shift
$76.39k - $146.44k
...Role and ImpactAs a Semiconductor Manufacturing Engineer, you will be instrumental in developing,... ...role is part of Intel's Assembly Technology Development team, a team dedicated to delivering world-class silicon packaging technology and high-volume manufacturing solutions...Full timeInternshipLocal areaImmediate startShift work- IPL is a global leading sustainable packaging solutions provider that manufactures specialty... ...injection molding machines, auxiliary equipment, and related processes. Perform mold... ...and best practices. Collaborate with engineering, production and quality control teams to...Local areaDay shift
$103.73k - $198.82k
...MDCE and Logic Technology development (LTD) organizations delivers... ...Work closely with device engineers to tune process conditions... ...with• Device Engineering• Equipment Engineering/Module Engineering• Yield... ...at IntelOur total rewards package goes above and beyond just...Full timeInternshipLocal areaImmediate startShift work
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