Laser Packaging R&D Engineer
Talanto
Talanto in the United States (Arizona, Phoenix) is seeking a Packaging Module Development Engineer in Laser Assembly to advance semiconductor packaging technologies. You will help develop laser packaging processes and equipment, impacting performance and reliability of assembly solutions. The role requires a strong background in physics/engineering, SPC/DOE, laser/optics, and data science tools. This on-site position offers competitive pay, stock bonuses, and health/retirement benefits. #J-18808-Ljbffr Talanto
Vacancy posted 1 day ago
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