HBM SoC Physical Design Engineer Intern
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Micron Technology, Inc. is seeking an SoC Physical Design Intern to support the HBM team in implementing high-bandwidth memory designs for AI and HPC applications.
You will work with experienced engineers on floorplanning, placement, clock tree synthesis, routing, and physical verification. Gain hands-on experience with timing analysis, signoff flows, automation tooling in Python, Tcl, and shell, and collaborate across RTL, verification, and architecture to deliver memory products powering
#J-18808-Ljbffr Jobleads-USVacancy posted 12 hours ago
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