Senior 3D/2.5D Packaging Design Engineer
black.ai
Syenta is seeking a Senior Advanced Packaging Design Engineer to lead physical layout and floor planning for 2.5D/3D interposers and high-density RDLs. You will drive die-to-package and package-to-board co-design, collaborating with ASIC, SI, and PI teams to ensure robust designs. With 5+ years in semiconductor packaging, you will tackle design verification, DFM collaboration, and reliability optimization to push performance while managing manufacturability and thermal/structural challenges. #J-18808-Ljbffr black.ai
Vacancy posted 2 days ago
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