Senior Advanced Packaging / Substrate Design Engineer (2.5D/3D Chiplets)

About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste. Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing. About the Role We are seeking a Senior Advanced Packaging Design Engineer to drive the physical design, layout, and implementation of next-generation heterogeneous integration platforms. In this role, you will be at the forefront of semiconductor innovation, designing complex 2.5D and 3D organic substrate interposers, high-density RDLs, and chiplet architectures for high-performance computing (HPC) and AI applications. If you have a passion for pushing the boundaries of physical layout, die-to-package co-design, and advanced substrate manufacturing, we want you on our team. Responsibilities Physical Layout & Floor planning : Lead the physical design, floor planning, pad/bump allocation, and complex routing of multi-layer organic substrates and 2.5D/3D interposer architectures. Co-Design Execution: Drive die-to-package and package-to-board co-design, collaborating closely with ASIC design, signal integrity (SI), and power integrity (PI) engineering teams. Design Verification: Run and resolve advanced Design Rule Checks (DRC), Layout Versus Schematic (LVS), and electrical rule checks specific to fine-pitch packaging technologies. DFM & Manufacturing Collaboration: Work directly with substrate foundries and OSATs to ensure design-for-manufacturing (DFM) compliance, handling build-up sequences, microvia rules, and coreless substrate constraints. Reliability Optimization: Coordinate with thermal and mechanical engineering teams to mitigate warpage, CTE mismatch, and thermo-mechanical stress in organic substrate designs. Requirements Education: B.S. or M.S. in Electrical Engineering, Computer Engineering, Materials Science, or a related technical discipline. Experience: 5+ years of hands-on experience in semiconductor packaging layout, substrate design, or physical verification. Domain Knowledge: Deep understanding of 2.5D/3D IC integration, chiplet architectures, silicon bridges/interposers, and advanced organic substrate technologies (ABF build-up, fine-pitch routing). EDA Tool Proficiency (Must-Have): Proven mastery of industry-standard advanced packaging EDA tools, including: Synopsys : 3DIC Compiler, Icepak and/or Flotherm Cadence : Allegro Package Designer Plus / Innovus Siemens (Mentor) : Xpedition Substrate Integrator / Calibre Analysis Awareness: Familiarity with power integrity, signal integrity, and thermal-mechanical modeling tools (e.g., Ansys Redhawk,HFSS). Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment Why Choose Syenta? We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry. What We Offer Competitive salary Early-stage equity opportunities Potential 401(k) and other benefits Comprehensive health, dental, and vision coverage plans, supported by Company Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business Team Events – Annual company event in Australia to collaborate and celebrate Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life 15 days PTO and 10 days sick leave Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law. #J-18808-Ljbffr black.ai