Senior Process Engineer (San Diego)

Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CA

A rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications .

We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes , particularly Flip Chip and Thermo-Compression Bonding (TCB) .

What you’ll be doing:

• Develop and optimise optoelectronic assembly processes
• Lead Flip Chip and TCB process development
• Support 2.5D/3D packaging integration
• Work with suppliers and manufacturing partners to scale processes
• Design and execute DOE to improve yield and performance
• Monitor process health, including yield and failure Pareto trends
• Develop SOWs and project plans for new process development

What we’re looking for:

• 5+ years' experience in manufacturing/process engineering
• Strong expertise in Flip Chip and Thermo-Compression Bonding
• Experience with 2.5D/3D packaging and reliability challenges
• Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar
• Experience with FMEA
• Understanding of optoelectronic devices and packaging reliability
• Knowledge of microelectronics/photonics packaging processes
• Bachelor's degree in Engineering, Physics or a related discipline
• Comfortable working in a fast-paced, high-growth environment

This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.

Location: San Diego, CA – Hybrid

Salary: $160,000–$190,000 + Equity + Full Benefits Package