Principal HBM Tapeout Execution & Release Coordination
Micron Semiconductor Products Inc
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Within Micron’s Heterogeneous Integration Group (HIG), we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI, high-performance computing, and data-centric applications. Our team collaborates across design, product, manufacturing, and ecosystem partners to deliver innovative memory technologies with exceptional quality and execution excellence.The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule.Responsibilities:Lead tapeout execution and release coordination for HBM builds, managing schedules, DBR achievements, and release readinessDrive preparation, review, and completion of tapeout collateral, including TOAST, RCDB, TWIT, and related release documentationCoordinate signoff readiness across timing, power, physical verification, integration, and other release-critical activitiesEnsure database quality, completeness, traceability, and signoff evidence are in place prior to tapeoutManage release risks, waivers, open items, and governance processes while maintaining strong release discipline across programsMinimum Qualifications:Bachelor’s degree in Electrical Engineering or a related field, or equivalent experienceProven experience with SoC, memory, or semiconductor tapeout execution and design release processesStrong knowledge of DBR processes, tapeout checklists, release governance, and signoff methodologiesHands-on experience preparing or reviewing TOAST, RCDB, TWIT, or equivalent tapeout artifactsDemonstrated ability to manage release readiness, risk tracking, and progress in deadline-focused environmentsPreferred Qualifications:10+ years of relevant semiconductor industry experienceExperience coordinating cross-functional design, verification, physical design, and product engineering teams through tapeoutStrong analytical, problem-solving, and technical decision-making skills with exceptional attention to detailExperience with formal program or project management tools and methodologiesExperience working with Agentic AI tools to assist with design and verificationAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on job-api.jobget.com or View phone number on job-api.jobget.com (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.SummaryLocation: Richardson, TXType: Full time
- ...intelligence, inspiring the world to learn, communicate and advance faster than ever.Key ResponsibilitiesAct as the tapeout execution and release coordination lead for HBM designs targeting internal Micron manufacturing.Own and manage tapeout schedules, DBR milestones, and...PrincipalFull timeLocal areaImmediate start
$146k - $309k
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$150k - $308k
...communicate and advance faster than ever.Job DescriptionWe are the HBM Design Architecture team within Micron’s HBM DRAM Engineering... ...practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and...PrincipalFull timeLocal areaImmediate startWorldwide$177k - $309k
...Physical Design Senior Manager, HBM in the Heterogeneous... ...robust signoff collateral for tapeout. This is a hands‑on role with... ...power integrity.Perform and/or coordinate physical signoff including DRC... ...efficiently.Support tapeout execution (checklists, ECO flows, signoff...Full timeLocal areaImmediate startNight shift- ...Overview As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural...PrincipalLocal area
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$175k - $297k
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$230k - $295k
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...across multiple geographies.Demonstrated success building and executing technology strategy aligned to business outcomes.Strong executive... ...development efficiencies, quality of test/QA coverage, and release managementLeads and is responsible for the end-to-end test strategy...PrincipalFull timeWork experience placementWork at officeFlexible hoursShift workDay shift- ...Program LeadershipApplies deep knowledge of cloud platforms and delivery management to ensure successful execution of key technology objectives. Leads and coordinates cross-functional teams to deliver cloud infrastructure solutions accurately and on schedule, providing...Principal
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$107.5k - $204.5k
...strong hands‑on expertise in AI‑driven systems, cross‑functional coordination, and guiding teams through the adoption of modern development... ...Technology (DT), and other organizations to ensure aligned execution and clear communication.Serve as a trainer and mentor for...PrincipalTemporary workWork experience placementWork at officeRemote workRelocation packageFlexible hours
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