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Senior Engineer, Package Design

$190k

Job Juncture

Role Summary: We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing. Key Responsibilities: Perform package substrate design and analysis (SI/PI/routing) Collaborate with layout engineers, marketing, and global design teams Use tools like HFSS, ADS for package modeling/simulation Qualifications: BS in EE or related field; MS preferred 810 years of experience in semiconductor package design Strong SI/PI analysis, modeling, and simulation skills Excellent communication, teamwork, and presentation abilities Preferred Skills: Expertise in high-speed package/PCB design (SerDes, PCIe, LPDDR, Ethernet) Time/frequency domain analysis, impedance, jitter, eye-diagram, BER analysis Experience with Hspice, Redhawk, electro-thermal simulation, PDN modeling Familiarity with reliability analysis and packaging/assembly rules Why is This a Great Opportunity: outstanding technology, great opportuity to learn. Growing company with a lot of IP. Everyone contributes. Salary Type : Annual Salary Salary Min : $ 190000 Salary Max : $ 220000 Currency Type : USD #J-18808-Ljbffr

Vacancy posted 8 hours ago
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