PCB Design Engineer - HDI Multilayer

PCB Design Engineer, High Speed Multilayer SystemsHuntsville, AL$100,000 to $140,000 per yearThis employer is part of a larger global technology organization and is a recognized leader in rugged, open architecture embedded computing for defense, aerospace, and industrial markets. The team designs complex, high-density printed circuit boards supporting next generation embedded computing platforms for military, industrial, and scientific applications.ScheduleFull time, direct hire position based in Huntsville, AL. Travel is minimal.Compensation$100,000 to $140,000 per year, based on experience and qualifications.What You'll DoAs a PCB Design Engineer, you will design complex, high density multilayer PCBs (typically 14 to 24 or more layers), owning stack-up construction, via technology (blind, buried, and microvia), and routing strategy using both manual and auto-assisted techniques. You will translate schematics into manufacturable layouts for high speed digital interfaces including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high speed Ethernet, Fibre Channel, and SerDes, working closely with electrical, FPGA, mechanical, and signal integrity engineers through design reviews, fabrication documentation, and DFM/DFA/DFT release.Required QualificationsBachelor's degree in Electrical Engineering, Electronic Engineering, or related discipline, or equivalent experience2+ years of professional PCB layout experience, with Siemens EDA Xpedition (Layout and DxDesigner) strongly preferredStrong background in high speed digital PCB design: DDR4/DDR5, GDDR, PCIe Gen4/5, Gigabit/high speed Ethernet, Fibre Channel, SerDes, controlled impedance and differential pair routingExperience with HDI technologies (blind/buried vias, via-in-pad, sequential lamination, microvias) and dense multilayer stack-upsHands on experience with BGA, fine pitch BGA, QFN, high pin count FPGA layouts, and rigid or rigid-flex designsStrong understanding of signal integrity, power integrity, DFM, DFA, and DFT principlesExperience creating fabrication, assembly, and manufacturing documentationMust be a U.S. Citizen or Green Card holder (visa sponsorship is not available for this role)Preferred QualificationsExperience migrating designs from Altium, Cadence Allegro, OrCAD, PADS, Zuken, or PCAD into XpeditionExperience with RF, analog, mixed signal, and FPGA based PCB layoutsExperience designing for aerospace, defense, space, radar, or other mission critical applicationsWorking knowledge of IPC standards and military specificationsExperience mentoring PCB designers or establishing design methodologiesAbility to leverage AI assisted engineering tools while validating engineering accuracyCompensation and BenefitsSalary range of $100,000 to $140,000 per year, plus annual performance incentivesMedical, dental, and vision insurance401(k) retirement plan with company contributionPaid time off and paid holidaysCareer development and technical training opportunitiesTo apply, submit your resume for consideration.