HBM SoC RTL Design Engineer

Req ID: JR101388 HBM SoC RTL Design Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands‑on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field, with a minimum of 10 years of experience in a related field. Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies. Experience with the RTL‑to‑GDS flow, including synthesis, static timing analysis, and develop sign‑off considerations. Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens. Programming or scripting experience (e.g., Python, TCL, Perl, or shell scripting). Preferred Qualifications Experience with HBM, DRAM, or memory‑centric SoC designs. Familiarity with high‑speed interfaces, clocking strategies, reset architectures, and power management concepts. Exposure to DFT concepts (scan, MBIST, BIRA/BISR) and debug. Experience with hardware emulation or acceleration platforms. (e.g., Palladium, Veloce, Zebu) Job Profile(s) Systems Design Engineer 4 - Systems Design Engineer 5 Relocation Level: TBD The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $146,000.00 - $297,000.00 a year Additional compensation may include benefits, bonuses and equity. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. medical, dental and vision plans benefit programs that help protect your income if you are unable to work due to illness or injury paid family leave robust paid time-off program paid holidays For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology