Sign up to access all features of our service.
  • Job search
  • Favorites
  • Create a CV
    New
  • Salaries
  • Subscriptions

Principal HIG ESD and Latch-up Engineer- HBM - TPG

$175k - $297k

Micron Technology Inc

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.We are part of Micron’s HBM Design Architecture organization, where we push the limits of memory technology every day. Our team works across global, multicultural engineering groups to build next-generation HBM solutions that power AI and machine learning. We believe the best ideas come from collaboration, curiosity, and a shared drive to innovate!This role plays a critical part in ensuring the reliability of Micron’s most advanced DRAM and HBM products. As an ESD & Latch Up Engineer, you will shape protection strategies from early design through high-volume manufacturing, working hands-on with silicon, layout, and foundry partners. If you enjoy solving deep technical problems and influencing product robustness at scale, this role offers both impact and growth. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.Responsibilities:Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfacesEstablish ESD and latch up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standardsEnable ESD protection circuits and latch up safe layout practices across designs and technologiesLead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon resultsAct as the technical interface to foundries and partner closely with design, packaging, reliability, and product teamsMinimum Qualifications:Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experienceStrong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devicesHands-on experience with ESD protection circuits and latch up prevention techniquesFamiliarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78Preferred Qualifications:Experience supporting ESD and latch up sign-off for advanced DRAM or HBM productsKnowledge of SCR-based clamps, distributed ESD networks, and rail-based strategiesExperience working directly with foundry ESD and latch up teamsProven ability to mentor engineers and influence design methodology across teamsThe US base salary range that Micron Technology estimates it could pay for this full-time position is:$175,000.00 - $297,000.00 a yearAdditional compensation may include benefits, bonuses and equity.Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted onmicron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at View email address on click.appcast.io or View phone number on click.appcast.io (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.SummaryLocation: Folsom, CA; Richardson, TXType: Full time

Vacancy posted 3 days ago
Similar jobs that could be interesting for youBased on the Principal HIG ESD and Latch-up Engineer- HBM - TPG in Folsom, CA vacancy
  • $177k - $334k

    Micron Technology is looking for a Senior Engineer as an SMTS/DMTS HBM ESD/Latch‑Up Architect to lead the definition of ESD and latch‑up architecture across various components. The ideal candidate will have over 10 years of experience and a strong background in advanced... 
    Suggested

    Micron Technology

    Folsom, CA
    16 hours ago
  • $177k - $334k

    Micron Technology, Inc in Folsom, California is seeking a Sr. Member Technical Staff to lead ESD and latch-up architecture for next-generation HBM products. The ideal candidate will have a strong background in ESD design and reliability, with 10+ years of experience, and... 
    Suggested

    Micron Technology

    Folsom, CA
    4 days ago
  • $177k - $334k

    Sr. Member Technical Staff - ESD and Latch‑Up - HBM Our vision is to transform how the world uses information to enrich life for all. Micron...  ...challenges Minimum Qualifications MS or PhD in Electrical Engineering or related field, or equivalent practical experience 10+... 
    Suggested
    Local area

    Micron Technology, Inc

    Folsom, CA
    4 days ago
  • $177k - $334k

    SMTS/DMTS HBM ESD/Latch‑Up Architect - Micron Technology Micron Technology invites a Senior Engineer to define protection strategies across base die, DRAM stacks, and interconnects, shaping product reliability from early architecture through silicon validation. The role... 
    Suggested
    Full time
    Local area

    Micron Technology

    Folsom, CA
    4 days ago
  • Micron Technology is seeking a Sr. Member Technical Staff to define end-to-end ESD/Latch-Up architectures for HBMs, across base dies, DRAM stacks, and interconnects. The role drives protection strategies for high-speed I/O and TSV interfaces, and establishes standards and... 
    Suggested

    Micron Memory Malaysia Sdn Bhd

    Folsom, CA
    16 hours ago
  • $199k - $347k

     ...communicate and advance faster than ever.As a Static Timing Analysis (STA) Engineer, you will be part of the Heterogeneous Integration Group (HIG), owning chip-level timing sign-off for next-generation HBM products. You will work closely with RTL design, physical design,... 
    Full time
    Local area
    Immediate start

    Micron

    Folsom, CA
    16 hours ago
  • $146k - $309k

     ...learn, communicate and advance faster than ever.As a Principal SoC DFT Engineer within the Heterogeneous Integration Group (HIG), you will be responsible for the DFT architecture, implementation, and signoff of complex HBM base-die System-on-Chip (SoC) designs. This role... 
    Principal
    Full time
    Local area
    Immediate start

    Micron

    Folsom, CA
    4 days ago
  • $146k - $309k

     ...communicate and advance faster than ever. Position: Principal SoC DFT Engineer - Heterogeneous Integration Group (HIG) As a Principal SoC DFT Engineer within the...  ...architecture, implementation, and signoff of complex HBM base-die System‑on‑Chip (SoC) designs. This role is... 
    Principal
    Local area

    1000 Micron Technology, Inc.

    Folsom, CA
    3 days ago
  • Micron Technology seeks a Principal DFT Engineer in Folsom, CA to own DFT for HBM base-die SoCs, drive architecture, and signoff across RTL, synthesis, and physical design. Collaborate with RTL, verification, and test teams to ensure robust testability and manufacturability... 
    Principal

    Micron Memory Malaysia Sdn Bhd

    Folsom, CA
    3 days ago
  • 1000 Micron Technology, Inc. is seeking a Principal SoC DFT Engineer to lead DFT architecture, implementation, and signoff for complex HBM base-die SoC designs. The ideal candidate will collaborate with RTL design, verification, and physical design teams to ensure robust... 
    Principal

    1000 Micron Technology, Inc.

    Folsom, CA
    3 days ago
  • $146k - $297k

     ...intelligence, inspiring the world to learn, communicate and advance faster than ever.As an HBM Power Delivery Network (PDN) Engineer, you will be part of the Heterogeneous Integration Group (HIG), responsible for the design, analysis, and optimization of power delivery networks... 
    Full time
    Local area
    Immediate start

    Micron

    Folsom, CA
    1 day ago
  • Micron Technology, Inc in Folsom, California is seeking a Principal DFT Engineer to lead DFT implementation and architecture definition for HBM base-die designs. Candidates should have 7+ years of experience in SoC design and a Bachelor's degree in Electrical Engineering... 
    Principal

    Micron Technology, Inc

    Folsom, CA
    3 days ago
  • $161k - $340k

     ...with driving execution of the products in high bandwidth memory (HBM) portfolio that will position Micron for success in growing the...  ...a cross-functional team of key representatives from multiple engineering, marketing, and operations teams to ensure the execution of product... 
    Principal
    Full time
    Local area
    Immediate start

    Micron

    Folsom, CA
    6 days ago
  •  ...Overview Micron Technology is a world leader in memory and storage solutions. As a Member of Technical Staff HBM Design Architect, you will design and develop the high-speed interface between DRAM and base die in HBM cubes, including command and control logic. Responsibilities... 
    Principal
    Local area

    Jobleads-US

    Folsom, CA
    16 hours ago
  • Micron Technology is seeking an HBM Power Delivery Network Engineer in Folsom, California, to design, analyze, and optimize power delivery networks for next-generation HBM products. This role focuses on ensuring efficiency and manufacturability while achieving aggressive... 

    Micron Technology

    Folsom, CA
    1 day ago
  • $114k - $171k

     ...impossible. Our employees are not only part of history, they're making history.Northrop Grumman Mission Systems is seeking a Principal Systems Engineer or a Sr Principal Systems Engineer with a Signal Processing background to work in Sacramento, California. Join a team... 
    Principal
    Full time
    Relocation package
    Shift work

    Northrop Grumman

    Mcclellan, CA
    4 days ago
  • $114k - $171k

     ...provider of mission-enabling solutions for global security. Our Engineering and Sciences (E&S) organization pushes the boundaries of...  ...part of our mission!We are looking for you to join our team as a Principal Mechanical Engineer based out of McClellan, CA. As a Mechanical... 
    Principal
    Full time
    Work at office
    Relocation package
    Shift work

    Northrop Grumman

    Mcclellan, CA
    3 days ago
  • $75k - $232k

     ..., PCIe Switches, and SAS Expanders used in cloud storage and enterprise data centers. We are looking for a hands-on Principal System Validation Engineer to join our team in Roseville and take ownership of silicon bring-up, system integration, and validation of next-generation... 
    Principal
    Full time
    Remote work

    Microchip Technology

    Roseville, CA
    2 days ago
  • $135k - $175k

    Roseville, CAEngineering - Quality Engineers /External /On-siteGeneral Summary As a Principal Quality Engineer, you will serve as a technical leader driving quality improvement across Operations. You will apply deep analytical expertise to strengthen process capability... 
    Principal
    Temporary work
    Work at office
    Local area

    Penumbra

    Roseville, CA
    4 days ago
  • Our Sacramento/ Davis office has an opening for a self-motivated engineer with 8-12 years of experience to work on projects related to groundwater wells, drinking water, water reuse and stormwater. When you join Brown and Caldwell, you will find that we offer a non-hierarchical... 
    Principal
    Full time
    Contract work
    Temporary work
    Work experience placement
    Live in

    Brown and Caldwell

    Rancho Cordova, CA
    16 hours ago
  • $140k - $180k

    GFT is seeking a talented Principal Civil / Structural Engineer to join our team in our Roseville, CA. This role follows a hybrid work model, requiring regular attendance at our Roseville office.Our specialists have the in-depth knowledge to excel on the most challenging... 
    Principal
    Full time
    For contractors
    For subcontractor
    Remote work

    Gannett Fleming

    Roseville, CA
    2 days ago
  • 1000 Micron Technology, Inc. seeks a Member of Technical Staff HBM Design Architect to design high-speed interfaces between DRAM and base die in HBM cubes. You’ll engage in circuit simulations and collaborate on various design aspects while supporting new product development... 

    Jobleads-US

    Folsom, CA
    16 hours ago
  • Micron Technology is seeking a Principal SoC DFT Engineer in the Heterogeneous Integration Group to own DFT architecture, implementation, and signoff for HBM base-die designs, collaborating across RTL, verification, physical design and product engineering. This role focuses... 

    Micron Technology

    Folsom, CA
    3 days ago
  • Micron Technology is looking for a SoC Design Engineer in Folsom, California, to contribute to next-generation HBM SoC logic die development. The role involves designing and implementing RTL for SoC-level blocks, collaborating with multi-functional teams, and participating... 

    Micron Technology

    Folsom, CA
    3 days ago
  • $146k - $297k

    1000 Micron Technology, Inc. is seeking a SoC Design Engineer to design and develop next-generation HBM SoC logic die. You will work with architecture, verification, and product teams to ensure high-performance solutions meet various targets. The role requires collaboration... 

    1000 Micron Technology, Inc.

    Folsom, CA
    3 days ago
  • $220.92k - $311.89k

     ...scalability across future nodes and products.We're looking for a Principal Engineer who thrives on solving hard problems, someone who can bring...  ...static circuits including state retaining elements such as latches and flops in circuit design, standard cell development, or... 
    Principal
    Full time
    Local area
    Immediate start
    Shift work

    Intel

    Folsom, CA
    4 days ago
  • $150k - $170k

     ...are looking for candidates who want to shape and drive innovation at Bosch. Job Description We are seeking an Electrical Engineer with specialized expertise in commissioning, project execution and operational readiness within a high-demand semiconductor... 
    Principal
    Full time
    Work experience placement
    Monday to Friday
    Flexible hours

    Bosch Group

    Roseville, CA
    14 days ago
  • General Dynamics Ordnance and Tactical Systems (OTS) is seeking a seasoned supply chain and logistics professional to optimize procurement, production planning, inventory control, outsourcing, and vendor selection. The role emphasizes cross-functional process integration...
    Principal
    Work at office

    General Dynamics Ordnance and Tactical Systems

    Folsom, CA
    4 days ago
  • $97k - $205k

     ...inspiring the world to learn, communicate and advance faster than ever.HBM Memory Design ArchitectOur vision is to transform how the world...  ...world uses information to enrich life. As an HBM Memory Design Engineer in the HBM architect team you will be responsible for designing... 
    Full time
    Local area
    Immediate start

    Micron

    Folsom, CA
    16 hours ago
  • $62.25 - $122 per hour

    Micron Technology in Folsom, California is seeking a skilled individual to design and develop critical analog, mixed-signal, and custom digital blocks. You will work on next-generation architectures, integrating full chip designs while performing thorough layout verification...
    Principal
    Hourly pay
    Full time

    Micron Technology

    Folsom, CA
    4 days ago

Do you want to receive more vacancies?

Subscribe and receive similar vacancies to Principal HIG ESD and Latch-up Engineer- HBM - TPG. Be the first to apply!