Mechanical Packaging Co-op: Innovate 3D Packaging & Thermal Design
Nokia
NOKIA is seeking a current M.S. or Ph.D. student in mechanical engineering or related fields for a 4-month onsite position in Sunnyvale, CA. Responsibilities include performing mechanical integrity and thermal simulations, supporting advanced packaging components, and driving debug activities. The ideal candidate should have experience in 3D CAD design and thermal simulations, especially using SolidWorks and ANSYS. Strong communication skills are essential, and familiarity with metrology techniques is preferred. #J-18808-Ljbffr NOKIA
Vacancy posted 3 days ago
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