Director of Technology - Advanced Semiconductors & 3D Packaging
University of Texas at Austin
A leading educational institution in Austin seeks a Director of Technology for its Texas Institute for Electronics. This pivotal role focuses on advancing semiconductor manufacturing through innovative research and development. The ideal candidate will have a Bachelor's degree in a relevant discipline and over 15 years of experience in semiconductor fabrication. Strong leadership, communication skills, and a collaborative approach are essential. This position also includes comprehensive employee benefits, fostering a supportive work environment.#J-18808-Ljbffr
- ...Director of Technology, Texas Institute for Electronics Join to apply for... ...Texas at Austin-supported semiconductor consortium of state and... ...execute a state‑of‑the‑arts 3D Heterogenous Integration manufacturing... ...domains, including advanced packaging, with the aim of...3DSemiconductorFor contractorsWork experience placementLive inWork at officeLocal areaImmediate startFlexible hours
$168.4k - $249.31k
About Marvell Marvell’s semiconductor solutions are the essential building... ..., our innovative technology is enabling new possibilities... ...Team, Your ImpactThe Marvell Advanced Packaging R&D team is responsible for... ...but not limited to, 2.5D and 3D packages, Co-packaged...3DSemiconductorPermanent employmentInternshipWork from home- ...you’ve built your own 3D printer or robots, get... ...industrial automation, semiconductor tools, PCB equipment,... ...applications in semiconductor packaging, printed circuit board... ..., semiconductor, advanced materials, chemistry,... ...most prominent global technology investors. We are...3DSemiconductorFull timeContract workTemporary work
- ...manufacturing systems for electronics, semiconductor, energy, and advanced-materials production. Our systems... ...: machined structures, high-voltage packaging, production racks, lamp heads, and quartz... ...of years of experience. ~ Strong 3D CAD. Inventor preferred; SolidWorks,...3DSemiconductor
- ...Head of AI Photonics Packaging Location: Austin, TX or... ...we have engineered a technology platform delivering 10... ...experienced leader in advanced packaging to build and... ...integration, and 2.5D/3D assembly (such as CoWoS... ...hands‑on experience in semiconductor packaging technology...3DSemiconductorFull time
- ADVANCE YOUR CAREER. ADVANCE THE WORLD.At AMD, we believe technology can change lives for the better. It can heal... ....Foundry Advanced Packaging Sourcing ManagerTHE ROLE... ...reporting to the Director Foundry Procurement.Develop... ...Extensive Founry or Semiconductor experience (specific...Semiconductor
$166.5k - $319k
...GlobalFoundries is a leading full-service semiconductor foundry providing a unique... ...the world’s most inspired technology companies. With a global... ...photonics engineer for the Advanced Photonics team that is... ...design, process technology, packaging, and test.Industry Awareness...SemiconductorFull timeLocal area- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorPermanent employmentLive inWork at officeLocal areaFlexible hoursNight shiftWeekend work
- ...Texas at Austin-supported semiconductor consortium of state and... ...a state-of-the-art 3D Heterogeneous Integration manufacturing technology roadmap and provide critical... ...and total rewards packages. Responsibilities FAB Throughput... ...semiconductor FAB or advanced packaging manufacturing...3DSemiconductorOngoing contractWork at officeLocal areaAll shiftsShift work
- University of Texas at Austin seeks a Manufacturing Operations Leader to direct end-to-end semiconductor advanced packaging fabrication. You will own wafer starts, cleanroom readiness, material flow, and tool availability, guiding cross-functional teams in production,...Semiconductor
- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorFull timeLive inWork at officeLocal areaMonday to FridayFlexible hoursShift workNight shift
$181k - $271k
...TitlePrincipal EDA R&D Engineer, Advanced PackagingJob ID18345... ...a career at the intersection of package substrate design and EDA tool development... ...will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions...Semiconductor- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorOngoing contractFull timeLive inWork at officeLocal areaMonday to FridayFlexible hoursShift work
- **Job Posting Title:**Semiconductor Inventory Manager, Texas Institute for... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide... ...semiconductor domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorFull timeLive inLocal areaImmediate startFlexible hours
- ...virtually every new chip and advanced display in the world.... ...display and semiconductor chips - the brains of... ...enables the exciting technologies that literally connect... ...and beyond advanced packaging technologies, leading... ...creation opportunities. The Director will build and lead a...SemiconductorFull timeRelocation
- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorOngoing contractWork experience placementLive inWork at officeLocal areaFlexible hours
- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorPermanent employmentContract workLive inWork at officeLocal areaMonday to FridayFlexible hoursShift workNight shift
$23 per hour
...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state‑of‑the‑art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorHourly payFull timeFor contractorsLive inWork at officeLocal areaFlexible hoursShift work- ...of Texas at Austin-supported semiconductor consortium of state and local... ...and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorOngoing contractPermanent employmentFull timeFor contractorsLive inWork at officeLocal areaMonday to FridayFlexible hoursShift workNight shift
- ...Posting Title: Assistant Director of Finance, Texas... ...at Austin-supported semiconductor consortium of state and... ...a state‑of‑the‑art 3D Heterogenous Integration manufacturing technology roadmap, and to provide... ...domains, including advanced packaging, with the aim of reestablishing...3DSemiconductorFor contractorsLive inWork at officeLocal areaImmediate startMonday to FridayFlexible hoursAfternoon shift
$308.6k - $417.5k
...proactively across Arm’s architecture and core technology teams to ensure a roadmap of... ...memory hierarchies, sophisticated 2.5D/3D packaging, performance / power modeling & estimation... ...or leadership position within the semiconductor industry. Ability to influence at all...3DSemiconductor$117k - $180k
...Semi is building a small, fast semiconductor fab. It’s already possible to build this with today’s technology and a few simplifications. We... ...build anything. We’ve set up 3D printers, a wide array of... ...manufacturing scale-up. The Packaging Team is responsible for designing...3DSemiconductorWork at officeVisa sponsorshipNight shift- Job DescriptionThe Package Development Engineer is responsible... ..., and industrializing semiconductor package solutions that... ...to bring new package technologies from concept through... ...integration, or advanced packaging technologies... ...(WLP/WLCSP)2.5D/3D PackagingKnowledge of...3DSemiconductor
- ...ASE (U.S.) INC. is seeking a Director of Engineering & Technical Marketing... ...market adoption of cutting-edge packaging platforms, including chiplet and 2.5D/3D architectures, across global customers... ...role bridges customer demand and technology strategy through technical...3D
- ...Texas Institute for Electronics (TIE) is a UT Austin-supported semiconductor consortium focused on advanced packaging and heterogeneous integration. The CAD Designer will create precise drawings, build 3D models, and maintain CAD files for ongoing projects that enable...3DSemiconductor
- Annapurna Labs, an AWS organization, seeks a Sr. Signal & Power Integrity Engineer to own package-level SI/PI strategy for 2.5D/3D-IC packaging in next-generation ML and data center ASICs. You will guide design closure, perform simulations, and align die, package, and...3D
$94.3k - $175.1k
...GlobalFoundries is a leading full-service semiconductor foundry providing a unique... ...some of the world’s most inspired technology companies. With a global manufacturing... ...transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors...3DSemiconductorFull timeLocal area- A major educational institution in Austin is seeking a Semiconductor Digital Architect to drive next-generation digital subsystem development for advanced microelectronics. The role requires deep expertise in architecture specifications and a proven track record in digital...3DSemiconductor
- ADVANCE YOUR CAREER. ADVANCE THE WORLD.At AMD, we believe technology can change lives for the better. It can heal... ...engineer to support the package design organization in... ...:Experience in semiconductor packaging or SOC physical... ...technologies such as 2.5D / 3D IC, Chiplets and...3DSemiconductor
- ...are more than just a semiconductor company; we are the engine... ..., and IoT technologies. By blending cutting-edge... ...DescriptionPrincipal Package Design EngineerLocation... ...This role will focus on advanced package architecture,... ...laminate, molding)2.5D/3D packagingSystem-in-package...3DSemiconductorWork at office
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