Postdoctoral Fellow — Semiconductor Bonding Metrology
$70k - $89kJohns Hopkins University
The Chronicle Of Higher Education, Inc. is seeking a PREP Research Associate in Gaithersburg, Maryland. This role involves designing and implementing test methods for evaluating chip bonding quality, requiring a PhD in a relevant field. Additional qualifications include experience with wafer bonding processes and proficiency in finite element modeling tools like COMSOL and ANSYS. The salary ranges from $70,000 to $89,000, with attractive total rewards. This position promises a collaborative environment supporting semiconductor advanced packaging. #J-18808-Ljbffr Johns Hopkins University
Vacancy posted 2 days ago
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