Postdoctoral Fellow (PREP0004280)

PREP Research Associate Salary: $70,000 - $89,000 Research Title Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging Responsibilities Design, model, and performance of test methods to evaluate bond quality of bonded chip pairs using different wafer materials and bond methods. Design and fabrication of test rigs for bond strength measurement. Implement bond strength testing at cryogenic and high temperatures. Closely coordinate with teams performing materials characterization, surface and thin film characterization. Qualifications PhD in mechanical engineering, physics, electrical engineering, materials science, or a related field. Experience with wafer and/or hybrid chip bonding processes. Experience with destructive test methods, such as those utilizing materials test machines or related instruments. Proficiency in finite element modeling, using tools such as COMSOL or ANSYS. Proficiency in CAD, using tools such as SolidWorks or Autodesk. Proficiency in programming languages, such as Python, Java, or Matlab. Excellent communication skills and ability to work effectively in a team. Experience, including process development, in back-end semiconductor device fabrication, including wafer cleaning and handling (desirable). Familiarity with silicon electronic and photonic device processing (desirable). Experience with custom infrared microscopy and optical measurement setups (desirable). US citizenship strongly preferred (desirable). Equal Employment Opportunity Statement The Johns Hopkins University is committed to equal opportunity and does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity, veteran status or other legally protected characteristic. Qualified individuals are given access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit. Total Rewards Johns Hopkins offers a total rewards package that supports our employees' health, life, career and retirement. More information can be found here: #J-18808-Ljbffr OHB System AG