Senior Engineer, Package Design
Sabio Systems
Key Responsibilities
- Own end-to-end package substrate design and analysis across SI, PI, and routing - from concept through tape-out.
- Partner with layout engineers, marketing, and global design teams to align on requirements and drive design decisions.
- Lead package modeling and simulation using HFSS, ADS, and related tools to validate performance against spec.
- Engage directly in pre- and post-sales processes, translating technical capabilities into customer-facing solutions.
- BS in Electrical Engineering or related field; MS preferred.
- 8-10 years of hands-on semiconductor package design experience.
- Deep expertise in SI/PI analysis, modeling, and simulation.
- Strong communicator and collaborator, comfortable presenting to both technical and non-technical audiences.
- High-speed package and PCB design across SerDes, PCIe, LPDDR, and Ethernet interfaces.
- Time- and frequency-domain analysis: impedance characterization, jitter, eye-diagram, and BER.
- Simulation toolchain experience: Hspice, Redhawk, electro-thermal, and PDN modeling.
- Working knowledge of reliability analysis, packaging rules, and assembly constraints.
Vacancy posted 2 days ago
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