Senior IC Package & Module Integration Engineer
Apple Inc.
Apple Inc. in the San Francisco Bay Area is seeking a senior IC packaging engineer to develop advanced packaging solutions for consumer products. You will interface with design, quality, supply chain and external suppliers to push new packaging technologies from concept to production. The role requires a BS with 10+ years in IC packaging, and preferred MS/PhD in mechanical engineering, physics or materials science. #J-18808-Ljbffr Apple Inc.
Vacancy posted 1 day ago
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