HBM SoC Physical Design Engineer — Lead Tape-Out & PPA
$146k - $309kMicron Technology, Inc
A leading semiconductor company is hiring an HBM SoC Physical Design Engineer in Boise, Idaho. The role entails driving implementation from netlist to GDSII, focusing on physical optimization and timing closure. Ideal candidates will have strong experience in SoC design, familiarity with EDA tools, and a solid understanding of physical verification processes. This full-time position offers a salary range of $146,000 to $309,000, plus benefits and opportunities for professional growth. #J-18808-Ljbffr Micron Technology, Inc
Vacancy posted 5 days ago
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