Assembler Tech - Wafer Fab

Job Description

Job Description

High Density, High Performance, and High Reliability Products for Aerospace & Defense

SSDI has been a pioneer in semiconductor manufacturing for over 50 years and has earned a reputation for setting the highest standards of reliability and performance. SSDI's high power and high voltage semiconductors and electronic systems meet the critical needs of many Aerospace and Defense applications.

Join Our Team as Assembler Tech!

We are currently seeking a motivated Assembler Tech to join our dynamic team in the Wafer Fab at Solid State Devices, Inc. This is a great opportunity to grow within a high-tech, cleanroom-based manufacturing environment!

Position: Assembler Tech

Department: Wafer Fab

Company: Solid State Devices, Inc. (SSDI)

Schedule: Full-time / Monday - Friday / 6:30am - 3:00pm  

Salary: Starts at $18.50 per hour / Bi-weekly Pay Schedule / Direct Deposit

This is not a guarantee of compensation or salary, as final offer amount may vary based on experience.

Key Responsibilities

• Diode Passivation - Application of protective coatings to semiconductor devices
• Diode Precap Activities - Pre-sealing inspection and preparation of diodes
• Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
• Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
• Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures
• Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment

In addition, you will be trained to perform the following specialized tasks :

• Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
• Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
• Diode Test - Perform electrical testing on diodes to verify performance specifications
• Metal Evaporation - Perform thin-film metal deposition using evaporation systems
• Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
• Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
• Wafer Stacking - Carefully handle and stack wafers for processing and transport
• Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
• Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
• Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers

All tasks include comprehensive hands-on training to ensure safety, accuracy, and process compliance. 

Required Qualifications

• Ability to perform basic math calculations (addition, subtraction, multiplication)
• Experience with Microsoft Office (Excel, Word, Outlook) is preferred

Education & Experience

• High School Diploma or equivalent
• At least 6 months of experience working in a relevant production or manufacturing position

Solid State Devices, Inc. proudly offers a comprehensive benefits package to all regular full-time employees, which includes:

• Medical, Dental, and Vision Insurance
• Group Life Insurance
• Term Life Insurance
• Long Term Disability Insurance
• Paid Time Off (PTO)
• 8 Paid Holidays
• 401(k) Plan (employer match - 45% up to the first 6% of contribution)
• Roth 401(k)

We are committed to supporting the health, financial security, and well-being of our employees and their families.

Solid State Devices, Inc. is an Equal Opportunity Employer

We consider all qualified applicants for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or any other legally protected status.

I understand that if I am extended an offer of employment, it will be conditional upon my successfully passing a post-offer, pre-employment Background and Drug Screen.

Upon employment, I agree to the following:

1. Signing an Employee Creation Assignment & Non-Disclosure
2. Abiding by all rules, regulations, and performance standards of Solid State Devices, Inc.
3. Application forms and materials are the property of Solid State Devices, Inc.