Integrated Circuit - Packaging Architect Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. The Role Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate will collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The role includes driving technology development initiatives from concept to qualifications, leading cross‑functional teams across geos in designing and developing novel package architectures and processes, and executing executive‑level communication on technology development progress. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions. The Person The candidate should have a proven track record of driving technology development in the semiconductor field, with leadership experience driving engineering teams in architecture definition, process definition, and/or yield improvement. Excellent oral and written communication skills are required to share complex signals and recommendations with technology partners, colleagues, product architects, and AMD management. Responsibilities Work with product architects in the early definition stage to understand and define package architectures and roadmap. Lead new package technology development initiatives from concept to full technology qualification. Drive test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines. Establish yield roadmap and lead implementation of yield and data analytic tools. Preferred Experience Experience in semiconductor technology development roles. Experience working with manufacturing partners such as suppliers, OSATs, and foundry partners. In‑depth knowledge of material science, thin film process development, and/or packaging. Experience in a leadership role driving cross‑functional teams. Proven track record of driving yield improvement and defect reduction in semiconductor fab or packaging environments. Education BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering, or equivalent. This role is not eligible for visa sponsorship. Benefits offered are described: AMD benefits at a glance. Equal Employment Opportunity and Other Statements AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal‑opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. #J-18808-Ljbffr AMD