LFAB Cu Plating Process Engineer

Change the world. Love your job. We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. As we continue to expand we're seeking an experienced Cu Plating Process Engineer. At full production, our wafer fabs will manufacture tens of millions of analog and embedded processing chips every day and power electronics everywhere, supporting customer demand for decades to come. We're committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K-12 STEM education. In this role, you will be part of the factory team that will lead the activities ramp of our latest 28nm technology to yield entitlement, helping shape the future of the semiconductor industry.The responsibilities of a Manufacturing Process Engineer in this role include:Join the team of dynamic engineers that work on process sustenance, development and transfer Support manufacturing operationsPerform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog TechnologiesSupport the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and qualityImplement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvementsPerform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog TechnologiesIdentify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous mannerSupport the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)Participate in data analysis and problem resolutionSupport 28nm CMOS Planar technologyWhy TI?Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TIBenefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits hereAbout Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Minimum requirements:3 years of experience within the Semiconductor industry within Electroplating/Plating.Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related engineering fieldStrong foundation in statistical process control, engineering change control and process release strategiesPreferred qualifications:Experience with Cu Plating and Cu Barrier Seed.BEOL process integration experienceDemonstrated strong analytical and problem solving skillsAbility to adapt and be dynamicAbility to work effectively in a fast-paced and rapidly changing environmentAbility to take the initiative and drive for resultDemonstrated ability to build strong, influential relationshipsStrong verbal and written communication skillsAbility to work in teams and collaborate effectively with people in different functionsStrong time management skills that enable on-time project deliveryFull timePosting Date: 2026-07-15