Quantum Superconducting Interconnect Integration Engineer

GlobalFoundries Fab8 is seeking an experienced R&D interconnect and interposer integration engineer to join our Quantum Advanced Packaging team. This role focuses on designing, developing, and integrating cryogenic, superconducting interconnect and interposer technologies that enable scalable quantum system integration. Responsibilities Lead development of superconducting interconnect and interposer integration processes (e.g., Nb, Al, In, superconducting liners, redistribution layers). Design 2.5D and 3D cryogenic interposer architectures for quantum systems. Define routing, metallization, and integration schemes optimized for low-loss RF/microwave signal propagation, minimal thermal leakage, and cryogenic reliability. Own end-to-end integration of interposer and interconnect flows across wafer-level processes (RDL, TSV/TOV, via formation) and die-level integration (bump, bonding, assembly interfaces). Drive process integration planning to enable new capabilities and prototyping across programs. Architect and integrate multi-die quantum packaging solutions, including qubit die + control electronics, superconducting interposers, and chiplet-style or system-level integration for scalable quantum systems. Translate system-level requirements into interconnect density, pitch, and routing specifications. Enable early-stage prototyping lots and ensure smooth execution through fab and assembly lines. Support transition to manufacturable, scalable flows, improve yield, manufacturability, and reduce cost/cycle time. Identify and drive understanding of failure modes (interconnect degradation, cryogenic stress-induced defects, interface reliability issues) and lead root-cause analysis and corrective actions. Collaborate with device and test teams to ensure interconnect solutions preserve qubit performance (coherence, noise) and meet cryogenic electrical and thermal constraints. Support system-level validation and characterization at cryogenic conditions. Develop expertise in superconducting materials and interfaces, low-temperature material behavior, and integration challenges. Work with equipment and suppliers to define process/tool requirements for superconducting metallization, interposer fabrication, and advanced 3D integration. Interface across device/qubit teams, assembly, bump, TSV integration teams, reliability and modeling teams. Collaborate with OSATs, suppliers, and research partners to co-develop interconnect technologies. Drive next-generation interconnect scaling (pitch, density, materials) aligned with quantum system scaling needs. Contribute to advanced packaging roadmap (APPC / cryo 3DHI) and evaluate emerging interconnect technologies and integration schemes. Generate integration flow documentation, process specs, design rules, technical reports, and progress updates for internal and external stakeholders. Contribute to IP, publications, and conference outputs. Perform all activities in a safe and responsible manner, supporting all environmental, health, safety & security requirements. Participate in hiring and mentoring of new Advanced Packaging team members in Singapore. Qualifications Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program. MS degree with at least 10 years of prior related work experience. Overall GPA of 3.0 or higher and proven good academic standing. Preferred Qualifications PhD education level preferred with at least 8 years of prior related work experience. Demonstrated prior leadership experience in the workplace, school projects, or competitions. Project management skills, including innovation and execution on impactful solutions. Strong written and verbal communication, planning, and organizational skills. EEO Statement GlobalFoundries is an equal opportunity employer. All qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation, and medical and or physical abilities. GlobalFoundries provides reasonable accommodations for qualified individuals with disabilities upon request. #J-18808-Ljbffr GLOBALFOUNDRIES US Inc.