Field Service Engineer-Chinese Bilingual

Field Service Engineer is responsible for equipment installation, maintenance, modification of equipment in the field, sales of


maintenance parts and troubleshooting


The secondary responsibility is developing, optimizing, yield improvement, process integration, and customer technical support, and sustaining fan-out wafer level packaging (FOWLP) processes.

• Role Weighting


• Process Engineering: Approximately 10-20%


• Field Service Engineering: Approximately 80-90%

Key Responsibilities


• Field Service Engineering (Primary Responsibility)


• Equipment Installation & Maintenance


• Support installation, setup, and qualification of backend equipment


• Perform and support FAT/SAT and customer acceptance testing


• Execute preventive and corrective maintenance as needed


• Discussion about specification of modification of equipment in the field.


• Sales activities of maintenance parts


• Equipment Troubleshooting & Escalation Support


• Troubleshoot mechanical, electrical, pneumatic, vacuum, and software issues of equipment, wafer handling robots, aligners, EFEM and new products that TAZMO Japan develops and market in the future.


• Diagnose process-induced tool issues and coordinate resolution


• Support tool calibration, recipe setup, and tool matching


• Documentation & Feedback


• Prepare service reports, RCA documentation, and customer communications


• Provide structured feedback to engineering teams for tool and process improvement


• Propose maintenance contract


• Prepare specification sheet of equipment


• Process Engineering


• FOWLP Process Development & Optimization


• Setup demo environment and an office in Arizona


• Develop new businesses by conducting demonstrations


• Develop, qualify, and optimize process, including Temporary


carrier bonding and debonding


• Optimization of process


• Lead DOE, SPC analysis, and yield improvement initiatives


• Customer & Cross-Functional Technical Support


• Serve as the primary technical interface for process-related topics


• Support customer process integration, NPI, and ramp to HVM


• Collaborate with product, equipment, quality, and R&D teams


• Support customer technical reviews, audits, and escalations


• Others


• Other general duties are based on projects or particular assignments as needed


• Required Qualifications


• Education


• Bachelor or master degree in:


o Materials Science


o Electrical Engineering


o Chemical Engineering


o Mechanical Engineering


• Experience


• 5-10 years of experience in:


o Semiconductor backend process engineering, and


o Advanced packaging or wafer-level packaging environments


• Hands-on experience with FOWLP processes and manufacturing


equipment


• Technical Skills


• Experience with:


o Backend process of semiconductor


o SPC, DOE, Cp/Cpk analysis


o Failure analysis and yield modeling


o Cleanroom and HVM environments


• Ability to read and interpret:


o Electrical schematics


o Mechanical drawings


o Pneumatic and vacuum diagrams


• Preferred Qualifications


• Experience supporting backend factories


• Knowledge of PLC


• Familiarity with power devices, AI/HPC packaging requirements


• Prior field service or customer-facing engineering experience


• Knowledge of slit die coating


• Soft Skills


• Strong analytical and structured problem-solving skills


• Excellent customer-facing communication abilities


• Ability to work independently at customer sites


• High level of ownership, accountability, and technical credibility


• Ability to communicate in traditional Chinese


• Misc.


• This job description is not an employment contract.


• This job description may be revised each year or as business needs dictate. Also, the description may be subject to change at management's discretion at any time.


• The job description does not constitute any assurance or guarantee of employment. The employee's employment by the Company is understood as "Employment-at-Will.


• Ability to routinely lift, pull, or push objects, up to 50 pounds with or without accommodation.

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