IC Package Design Engineer: AI-Driven SoC/SiP
Apple Inc.
Apple Inc. is seeking a Package Design Engineer in Austin, Texas to drive the design and integration of advanced semiconductor packages. You will lead physical design across various technologies, collaborating closely with cross-functional teams to enhance performance. The ideal candidate should have proficiency in Cadence Allegro or Mentor Xpedition and expertise in high-speed layout and Signal Integrity. The position emphasizes design methodology improvements and automation with scripting languages. Join a diverse team committed to inclusion and innovation. #J-18808-Ljbffr Apple Inc.
Vacancy posted 9 hours ago
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